High Temperature Semiconductor Devices Market Growing Rapidly by 2027 – BASF SE, FUJITSU, Henkel AG and Co. KGaA, Hitachi Chemical, Infineon Technologies AG, Koninklijke Philips N.V., LG Chem and Mordor Intelligence
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High temperature electronics is development of semiconductor devices designed to function reliably at temperatures in excess of 125 °C. Already conventional semiconductor materials like silicon or gallium arsenide are capable of operating to 300-400 °C using “temperature hardening” modifications in design and associated materials such as metallization schemes. High-temperature electronics applications are found in combustion systems, well logging and industrial processes, air stagnation points in supersonic aircraft, vehicle brakes, nuclear reactors and dense electronic packages.
The high temperature semiconductor devices market is heavily influenced by driving factors such as increase in demand for wireless devices, the rapid evolution of automated devices and low-cost manufacturing is expected to drive the high temperature semiconductor devices market over the forecast period. On the other hand, the dust produced while manufacturing of semiconductor creates serious concern to human health such as irritation to human eyes, skin and lungs which eventually increases the shielding outfit expenses used for manufacturing purposes which are expected to hinder the growth of high temperature semiconductor market over the forecast period
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Top Leading Market Players:
1. BASF SE
3. Henkel AG and Co. KGaA
4. Hitachi Chemical Co., Ltd.
5. Infineon Technologies AG
6. Koninklijke Philips N.V.,
7. LG Chem
8. Mordor Intelligence
9. NXP Semiconductors
10. Sumitomo Chemical Co., Ltd.
The global high temperature semiconductor devices market is segmented on the basis of material, by application and by end user. Based on material type the market is segmented as silicon carbide, gallium manganese arsenide, copper indium gallium selenide, molybdenum disulfide and bismuth telluride. On the basis of the application the market is segmented as substrates, lead frames, ceramic packages, bonding wire, encapsulation resins (Liquid),die attach materials. On the basis of end user the market is segmented as consumer electronics, manufacturing, automotive, energy and utility.
High Temperature Semiconductor Devices Market – Global Analysis to 2027 is an expert compiled study which provides a holistic view of the market covering current trends and future scope with respect to product/service, the report also covers competitive analysis to understand the presence of key vendors in the companies by analyzing their product/services, key financial facts, details SWOT analysis and key development in last three years. Further chapter such as industry landscape and competitive landscape provides the reader with recent company level insights covering mergers and acquisitions, joint ventures, collaborations, new product developments/strategies taking place across the ecosystem. The chapters also evaluate the key vendors by mapping all the relevant products and services to exhibit the ranking/position of top 5 key vendors.
The High Temperature Semiconductor Devices Market report is a combination of qualitative as well as quantitative analysis which can be broken down into 40% and 60% respectively. Market estimation and forecasts are presented in the report for the overall global market from 2018 – 2027, considering 2018 as the base year and 2018 – 2027 forecast period. Global estimation is further broken down by segments and geographies such as North America, Europe, Asia-Pacific, Middle East & Africa and South America covering major 16 countries across the mentioned regions. The qualitative contents for geographical analysis will cover market trends in each region and country which includes highlights of the key players operating in the respective region/country, PEST analysis of each region which includes political, economic, social and technological factors influencing the growth of the market.
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